CV

TENG LI

Assistant Professor

Department of Mechanical Engineering

University of Maryland

Affiliated faculty, Maryland NanoCenter

2141 Glenn L. Martin Hall

College Park, MD 20742

Tel: (301) 405 0364

Fax: (301) 314 9477

Email: LiT [at] umd.edu

Web: LiT.umd.edu

EDUCATION HARVARD UNIVERSITY

Ph.D. in Engineering Sciences, 2006

PRINCETON UNIVERSITY

M.A. in Material Sciences, 2003

TSINGHUA UNIVERSITY (CHINA)

Ph.D. (2001) B.S. (1996) in Engineering Mechanics

RESEARCH

· Mechanics of flexible electronics

· Mechanics of nanoelectronics

· Thin films and multilayered structures

· Mechanics of organic/inorganic hybrids

· Biomechanics of cells and subcellular structures

AWARDS Ralph E. Powe Jr. Faculty Award (ORAU) 2007

Gordon Research Conference (GRC) Best Poster Award 2006

on Thin film & Small Scale Mechanical Behavior, Waterville, ME

Gordon Research Conference (GRC) Poster Award 2005

on Ceramics, Solid State Studies In, Tilton, NH

Materials Research Society (MRS) Outstanding Poster Award 2004

16 out of 1700+ posters, Boston, MA

Gordon Research Conference (GRC) Best Poster Award (runner-up) 2004

on Thin film & Small Scale Mechanical Behavior, Waterville, ME

Princeton Materials Institute (PMI) Fellowship 2001-2004

Princeton University, Princeton, NJ

Best Creativity Award, Tsinghua Business Plan Competition, Beijing, China 1999

Mechanics Scholarship, Chinese Academy of Sciences, Beijing, China 1995

PROFESSIONAL SOCIETIES

Material Research Society

American Society of Mechanical Engineering

Society of Engineering Science

PROFESSIONAL SERVICES

· Co-founder and architect of www.imechanica.org, a web of mechanics and mechanicians

· Founder and Editor of www.macroelectronics.org, an interactive information platform for the emerging field of flexible macroelectronics

· Member, Technical Committee on Integrated Structures, American Society of Mechanical Engineers

· Reviewer for Applied Physics Letters, Journal of Mechanics and Physics of Solids, Scripta Materialia, International Journal of Solids and Structures, Advanced Functional Materials, Journal of Nanoparticle Research, AIAA Journal, International Journal of Fracture.

PUBLICATIONS

21. Z. Zhang, T. Li, Effects of grain boundary adhesion and grain size on ductility of thin metal films on polymer substrates, Scripta Materialia, in press (2008).

20. T. Li, A mechanics model of microtubule buckling in living cells, Journal of Biomechanics, 41, 1722-1729 (2008).

19. T. Li and Z. Suo, Ductility of thin metal films on polymer substrates modulated by interfacial adhesion, International Journal of Solids and Structures, 44, 1696-1705 (2007).

18. S.P. Lacour, T. Li, D. Chan, S. Wagner, and Z. Suo, Mechanisms of reversible stretchability of thin metal films on elastomeric substrates. Applied Physics Letter, 88, 204103 (2006).

17. T. Li, Z. Suo, Deformability of thin metal films on elastomer substrates. International Journal of Solids and Structures, 43, 2351-2363 (2006).

16. S.P. Lacour, S. Wagner, R.J. Narayan, T. Li and Z. Suo, Stiff subcircuit islands of diamond-like carbon for stretchable electronics. Journal of Applied Physics, 100, 014913 (2006).

15. S. P. Lacour, J. Jones, S. Wagner, T. Li, Z. Suo, Elastomeric interconnects. International Journal of High Speed Electronics and Systems, 16, 397-407 (2006).

14. T. Li, Z. Suo, S.P. Lacour, S. Wagner, Compliant thin film patterns of stiff materials as platforms for stretchable electronics. Journal of Materials Research, 20, 3274-3277 (2005).

13. Y. Xiang, T. Li, Z. Suo, J. Vlassak, High ductility of thin metal film adherent on polymer substrate. Applied Physics Letters, 87, 161910 (2005).

12. T. Li, Z.Y. Huang, Z.C. Xi, S.P. Lacour, S. Wagner, Z. Suo, Delocalizing strain in a thin metal film on a polymer substrate. Mechanics of Materials, 37, 261-273 (2005).

11. C. Tsay, S. P. Lacour, S. Wagner, T. Li, Z. Suo, How stretchable can we make thin metal films? Materials Research Society Symposium Proceedings, vol. 875, O5.5 (2005).

10. S. P. Lacour, J. Jones, S. Wagner, T. Li, Z. Suo, Stretchable interconnects for elastic electronic surfaces. Proceedings of the IEEE, 93, 1459-1467 (2005).

9. S. Wagner, S.P. Lacour, J. Jones, P.I. Hsu, J.C. Sturm, T. Li, Z. Suo., Electronic skin: architecture and components. Physica E, 25, 326-334 (2004).

8. T. Li, Z.Y. Huang, Z. Suo, S.P. Lacour, S. Wagner, Stretchability of thin metal films on elastomer substrates. Applied Physics Letters, 85, 3435-3437 (2004).

7. T. Li, W. Yang, Critical linkages of coalescing microcracks under stress loading. Fatigue & fracture of engineering materials & structures 25, 499-508 (2002).

6. T. Li, W. Yang, Expected length of coalescing collinear microcracks under displacement loading. Theoretical and Applied Fracture Mechanics, 36, 17-21 (2001).

5. T. Li, W. Yang, Global scheme of Lunar-Earth information network. Proceeding of the First International Conference on Astronautics and Aeronautics, 477-480 (2000).

4. T. Li, W. Yang, Coalescence of microcracks in brittle materials. Proceeding of Asian Pacific Conference for Fracture and Strength Societies, KR02, (1999).

3. T. Li, W. Yang, LunarNet — An innovative project for Lunar mission. Proceeding of The Eighth International Space Conference of Pacific-basin Societies, 698-701, (1999).

2. S-L. Zhang, T. Li, W. Yang, Statistical strength of brittle materials with strongly interacted collinear microcracks. International Journal of Solids and Structures 35, 995-1008 (1998).

1. W. Yang, S-L. Zhang, T. Li, Strong interaction among randomly distributed microcracks. Invited paper in Proceedings of the Ninth International Conference on Fracture, 4, 1971-1978 (1997).

C.V. (as of 20 June 2008)